• AOI光學檢測儀

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    AOI光學檢測儀

    TR7500SIII 3D

    性能特點：

    九成新德律TR7500SIII3DAOI光學檢測儀

    TRI絕佳的3D AOI解決方案，提供最快速的多角度PCB檢測，搭配藍光雷射3D真實輪廓測量，對于自動化檢測不良現象可達到最大化覆蓋率。結合最先進的軟體解決方案以及第三代智能化硬體平臺，TR7500 SIII 3D可提供穩定且強大的3D 錫膏與元件缺陷檢測，具備高檢測覆蓋率與簡易編程優點。

    德律TR7500SIII3D特性：

    1. 高速彩色多角度檢測，可檢測至01005元件

    2. 高缺陷覆蓋率，采用混合式2D+3D檢測技術

    3.真實3D輪廓量測技術，采用雙雷射單位

    4. 具備自動化資料庫與離線編程功能的智能化快速編程介面


    產品詳情

    九成新德律TR7500SIII3D介紹

    TRI絕佳的3D AOI解決方案，提供最快速的多角度PCB檢測，搭配藍光雷射3D真實輪廓測量，對于自動化檢測不良現象可達到最大化覆蓋率。結合最先進的軟體解決方案以及第三代智能化硬體平臺，TR7500 SIII 3D可提供穩定且強大的3D 錫膏與元件缺陷檢測，具備高檢測覆蓋率與簡易編程優點。

    德律TR7500SIII3D

    德律TR7500SIII3D規格：

    Optical System

    Imaging MethodDynamic Imaging with true 3D profile measurement
    Top Camera4 Mpix
    Angle Camera1.3 Mpix or 6.5 Mpix (factory setting)
    Imaging ResolutionOptical: 10 μm, 15 μm
    Laser: 10 μm (optional), 20 μm, 50 μm

    Note: Factory setting
    LightingMulti-phase RGB+W LED
    3D TechnologySingle/Dual 3D laser sensors
    Max. 3D Range20 mm

    Inspection Performance

    Imaging Speed4 Mpix@ 10 μm 2D: 60 cm2/sec
    4 Mpix@ 15 μm 2D: 120 cm2/sec
    4 Mpix@ 10 μm 2D+3D: 27-39 cm2/sec*
    4 Mpix@ 15 μm 2D+3D: 40-60 cm2/sec*

    * Depending on board size and laser resolution

    Motion Table & Control

    X-Axis ControlBallscrew + AC-servo controller
    Y-Axis ControlBallscrew + AC-servo controller
    Z-Axis ControlN/A
    X-Y Axis Resolution1 μm

    Board Handling

    Max PCB SizeTR7500 SIII 3D: 510 x 460 mm*
    TR7500L SIII 3D: 660 x 460 mm
    TR7500 SIII 3D DL: 510 x 250 mm x 2 lanes, 510 x 550 mm x 1 lane

    * The testable PCB size range will vary depending on the configuration of laser probe
    PCB Thickness0.6-5 mm
    Max PCB Weight3 kg
    Top Clearance15 mm/25 mm/48 mm [optional]

    Note:
    (1) Laser resolution@ 50 μm is 25 or 48 mm (optional)
    (2) Laser resolution@ 20 μm is 25 mm
    (3) Laser resolution@ 10 μm is 15 mm
    Bottom Clearance40 mm
    Edge Clearance3 mm
    ConveyorInline
    Height: 880 – 920 mm

    * SMEMA Compatible

    Inspection Functions

    ComponentMissing
    Tombstoning
    Billboarding
    Polarity
    Rotation
    Shift
    Wrong Marking (OCV)
    Defective
    Upside Down
    Extra Component
    Foreign Material
    Lifted Component
    SolderExcess Solder
    Insufficient Solder
    Bridging
    Through-hole Pins
    Lifted Lead
    Golden Finger
    Scratch/Contamination

    Dimensions

    WxDxHTR7500 SIII 3D: 1100 x 1670 x 1550 mm
    TR7500L SIII 3D: 1300 x 1630 x 1655 mm
    TR7500 SIII 3D DL: 1100 x 1770 x 1550 mm

    Note: not including signal tower, signal tower height 520 mm
    WeightTR7500 SIII 3D: 1010 kg
    TR7500L SIII 3D: 1250 kg
    TR7500 SIII 3D DL: 1150 kg


    成功案例

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