• 3D SPI

    TR7007 SII

    性能特點:

    TR7007SII /TR7007SIIPLUS 3D SPI 九成新

    德律TR7007SII介紹:

    TR7007 SII是產業最快速的錫膏印刷檢測機,檢測速度高達200 cm2/sec。高精度在線型無陰影的錫膏印刷檢測解決方案提供全3D檢測,分辨率包含15 μm or 10 μm并具備高精度線型馬達平臺。此系統的特點包括closed loop function、強化的2D成像技術、自動板彎補償功能與條紋光掃描技術。此系列亦有雙軌架構之機型,在不增加機臺落地空間下,大幅提升了生產線的產能。

    德律TR7007SII特性:

    1. 業界最快速的錫膏印刷檢測機

    2. 無陰影條紋光檢測技術

    3.光學分辨率提供10 μm 及 15 μm 兩種選擇

    4. X-Y table線性馬達可提供無震動精確檢測

    德律TR7007SII規格:

    Optical System

    Imaging MethodDynamic Imaging
    Camera4 Mpix
    Imaging Resolution10 μm or 15 μm (factory setting)
    LightingRGB LED
    3D Technology2-way Digital Fringe Pattern
    Field of View4 Mpix@ 10 μm: 20 x 20 mm
    4 Mpix@ 15 μm: 30 x 30 mm

    Inspection Performance

    Imaging Speed4 Mpix@ 10 μm: 90 cm2/sec
    4 Mpix@ 15 μm: 200 cm2/sec
    Height Resolution0.4 μm
    Max. Solder Height@ 10 μm: 420 μm
    @ 15 μm: 385 μm

    Motion Table & Control

    X-Axis ControlLinear Motor and linear scale with DSP-based controller
    Y-Axis ControlBallscrew + AC-servo controller
    Z-Axis ControlBallscrew + AC-servo controller
    X-Y Axis Resolution0.5 μm
    Z-Axis Resolution1 μm

    Board Handling

    Max PCB SizeTR7007 SII: 510 x 460 mm*
    TR7007L SII: 660 x 610 mm
    TR7007LL SII: 850 x 610 mm
    TR7007 SII DUAL LANE: 510 x 310 mm

    *Board Size TR7007L SII: 50 x 50 - 660 x 610 mm (1.97 x 1.97 - 26.0 x 24.0 in) [optional]
    TR7007LL SII: 50 x 50 - 850 x 610 mm (1.97 x 1.97 - 33.5 x 24.0 in) [optional]
    PCB Thickness0.6-5 mm
    Max PCB WeightTR7007 SII: 3 kg
    TR7007L SII: 5 kg
    TR7007LL SII: 5 kg
    TR7007 SII DUAL LANE: 3 kg
    Top Clearance40 mm
    Bottom Clearance40 mm
    Edge Clearance3 mm
    Conveyor Height880 – 920 mm

    * SMEMA Compatible

    Inspection Functions

    DefectsInsufficient Paste
    Excessive Paste
    Shape Deformity
    Missing Paste & Bridging
    MeasurementHeight
    Area
    Volume
    Offset

    產品詳情

    德律TR7007SII介紹:

    TR7007 SII是產業最快速的錫膏印刷檢測機,檢測速度高達200 cm2/sec。高精度在線型無陰影的錫膏印刷檢測解決方案提供全3D檢測,分辨率包含15 μm or 10 μm并具備高精度線型馬達平臺。此系統的特點包括closed loop function、強化的2D成像技術、自動板彎補償功能與條紋光掃描技術。此系列亦有雙軌架構之機型,在不增加機臺落地空間下,大幅提升了生產線的產能。

    德律TR7007SII特性:

    1. 業界最快速的錫膏印刷檢測機

    2. 無陰影條紋光檢測技術

    3.光學分辨率提供10 μm 及 15 μm 兩種選擇

    4. X-Y table線性馬達可提供無震動精確檢測

    德律TR7007SII規格:

    Optical System

    Imaging MethodDynamic Imaging
    Camera4 Mpix
    Imaging Resolution10 μm or 15 μm (factory setting)
    LightingRGB LED
    3D Technology2-way Digital Fringe Pattern
    Field of View4 Mpix@ 10 μm: 20 x 20 mm
    4 Mpix@ 15 μm: 30 x 30 mm

    Inspection Performance

    Imaging Speed4 Mpix@ 10 μm: 90 cm2/sec
    4 Mpix@ 15 μm: 200 cm2/sec
    Height Resolution0.4 μm
    Max. Solder Height@ 10 μm: 420 μm
    @ 15 μm: 385 μm

    Motion Table & Control

    X-Axis ControlLinear Motor and linear scale with DSP-based controller
    Y-Axis ControlBallscrew + AC-servo controller
    Z-Axis ControlBallscrew + AC-servo controller
    X-Y Axis Resolution0.5 μm
    Z-Axis Resolution1 μm

    Board Handling

    Max PCB SizeTR7007 SII: 510 x 460 mm*
    TR7007L SII: 660 x 610 mm
    TR7007LL SII: 850 x 610 mm
    TR7007 SII DUAL LANE: 510 x 310 mm

    *Board Size TR7007L SII: 50 x 50 - 660 x 610 mm (1.97 x 1.97 - 26.0 x 24.0 in) [optional]
    TR7007LL SII: 50 x 50 - 850 x 610 mm (1.97 x 1.97 - 33.5 x 24.0 in) [optional]
    PCB Thickness0.6-5 mm
    Max PCB WeightTR7007 SII: 3 kg
    TR7007L SII: 5 kg
    TR7007LL SII: 5 kg
    TR7007 SII DUAL LANE: 3 kg
    Top Clearance40 mm
    Bottom Clearance40 mm
    Edge Clearance3 mm
    Conveyor Height880 – 920 mm

    * SMEMA Compatible

    Inspection Functions

    DefectsInsufficient Paste
    Excessive Paste
    Shape Deformity
    Missing Paste & Bridging
    MeasurementHeight
    Area
    Volume
    Offset

    Dimensions

    成功案例

    更多
      暫無記錄

    aigao视频在线观看免费