• SPI 3D Solder paste thickness tester

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    SPI 3D Solder paste thickness tester

    SPI PARMI HS60

    Performance characteristics：

    Price: Negotiable (available for rent or sale)

    Brand: PARMI SPI

    Model: SPI HS60

    Detection principle: Laser laser detection solder paste configuration: all solder paste/tin or Wuxi detection substrate configuration: all colors & all pads offline programming: Gerberworks SPC&


    Product details

    Project monitoring: SPCworks

    System diagnosis: SPImanager

    Scan resolution: 20μm

    Side resolution: 18μm

    High resolution: 0.2μm

    Solder paste height: 1000μm

    Solder paste size: 20X20mm

    Minimum solder paste size: 200X200μm

    Minimum solder paste pitch (Pitch): 150μm

    Rated power: 2.5kw

    Voltage: 220v

    Resolution frequency: 50/60Hz

    Measurement: Camera system: High frame rate C-MOS sensor, 18X18μm pixel resolution


    Success case

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