The only SPI device in the industry that uses this technology. Compared with other methods that only rely on CPU calculations, the calculation is faster. CPU-based PMP algorithm

3 groups of ring LEDs, white light, red light, blue light

True color, black and white two modes

4 megapixel industrial camera

62 frame image acquisition rate RGB linear (Tri-linear) CCD,

42mm scan line width

2352 x 1728,

18um 64 cm2/sec

42.3 x 31.1 mm (pixel size: 18um) 42mm line width, (pixel size: 20um)

0～550um 50～450um

0.36um 1.225um

+/- 1um

(Based on actual solder paste/calibration block) +/- 4um

(Based on actual solder paste)

Volume, area, height, XY position, shape, etc. Volume, area, height, XY position, shape, etc.

More/less tin, missing print, solder paste sharpening, bridging, offset, abnormal shape, dirty, etc.More/less tin, missing print, solder paste sharpening, bridging, offset, abnormal shape, dirty, etc.

<1% @3sigma volume <3% @3sigma, height 3um@3sigma

<10% <10%

Have,

Real-time automatic profiling motion compensation for each PCB bending